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High
performance and custom designed packages in ceramic and metal are now
available from ATEK Technology. Utilising the latest in ceramic design
and lightweight, high thermal packaging concepts, along with conventional
glass to metal seal technology, these cost effective packages are made
by IXION Technologies, leaders in package design and development. View
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Produced quickly and efficiently to meet the needs of high power semiconductor,
microelectronic and high speed communications applications, they are
ideal for use in fibre optic communications, launchers, detectors and
other active systems, high power devices and hybrid systems. Featuring
low cost leaded surface mount packages for application specific components,
the range also includes microwave and RF transistor packages as well
as semiconductor and MCM packages.
With over 30 years experience in specialist electronics, ATEK Technology
provides cost effective, high quality solutions to application specific
problems and will be working with the IXION design and production personnel
to develop custom designs that meet engineering requirements both quickly
and efficiently.
Other products from ATEK Technology include ATE and Spring Loaded Test
Probes and Receptacles, Speciality Materials, Wires and Foils, Terminals
and Feedthroughs, and a Product Sourcing Service.
Further information is available from Peter Ashburner:
ATEK Technology Limited, Technology House, Stewley, Ilminster, TA19
9YU.
Tel: 01823 481248, Fax: 01823 481120
email: enquiries@atektechnology.com
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